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The engineers at UMI have extensive experience in
performing failure analysis on active and passive devices.
These engineers are ready to assist you with your device
failure analysis or design debug.
- FEI-600 CE Circuit Modification FIB. Infrared/Database navigation, backside circuit midification,
Copper/Low-K compatible, 5nm resolution.
- FEI-800 8-inch compatible Focused Ion Beam Workstation including the capability to handle copper.
- HITACHI S-4800 Dual Detector, Cold Field Emission SEM with Backscatter Detector and
retarding voltage options. Resolution down to 1nm. Magnification 35k->800k
- QFI TIVA/LIVA System. A laser based thermal and photocurrent stimulation system
for the detection of defects and circuit elements that contribute to
standby current and leakage failures.
- QFI Infra-Red Detection System. Excellent for front and back side thermal emissions analysis
of standby current and leakage failures.
- QFI Photon Emission Microscope. Excellent for front and back side hot electron emissions analysis
of standby current and leakage failures.
- Advantest T5593 500-1000 MHz Memory tester.
- Trion Plasma Etch for dry de-layering.
- Nisene Technology Group D Cap d2i de-capper for opening plastic packages.
- Full wet lab capability for wet de-layering.
- Microprobe Stations with hot/cold chuck and high impedance FET probes or DC microprobes for
mechanical microprobing.
- HP 4155 curve tracer/parametric analyzer, HP 8180/8175 signal generators, HP 8082/8015
Pulse Generators, HP 4282A LCR meter, HP 54403 2.5GHz Oscilloscope,
Tektronix TDS6154C 15Ghz Oscilloscope, Thermostream Temp
Forcer, various power supplies and meters.
- Nikon Optical Microscope.
- Allied Multiprep lapping system for precision deprocessing of IC's.
- UltraTech precision grinding/polishing tool for backside prep for FIB/Backside EFA.
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